Products

Electronic assemblies with surface-mounted components.

Specifications

• max. PCB size: 420х380 mm
• chips size: 01005…2225
• simultaneous assembly: 320 part types
• max. components size: 45х100, height up tо 35 mm
• distance between BGA leads: 0.5
• mounting of PB and PB-free components
• output: 50,000 components per hour
• automated components pick-and-place

Technologies

• convection reflow soldering
• selective soldering
• ultrasonic rinsing
• high-resolution X-ray control with with tomography function
• inspection
  • parameters
  • functionality
  • diagnostic

Manufacturer

• OOO “IRZ-Foton”