Production of LF, HF and SHF-band hybrid integrated circuits
Products
Microstrip boards (resistive boards, backplanes)
on alumina ceramic, glass ceramic, ceramic (V-20, V-40, TL-0 and ТL-75), ferrite or barium titanate substrates dimensions: from 2х2 mm tо 60х48 mm resistivity of resistive layer: from 1 tо 10000 Оhm/mm2
on alumina ceramic substrates with plated through vias and with three-, four- and five-sided metallization. Film conductors: from 1 to 23 μm, 25 μm minimum width; manufacturing precision: ±5 μm; protective electroplating: gold, tin-bismuth
on Rogers RT / Duroid metallized dielectric materials. Dimensions: up to 60x120 mm, manufacturing precision: ±5 μm
Discrete passive components
Thin-film resistors based on chromium or RS-3710, RS-5402, RS-5406 and K-50S alloys
Leucosapphire capacitors
Inductance coils based on alumina ceramics resistance: from 4 Оhm tо 500 Оhm; manufacturing precusion: up to 2% total capacitance: 5 and 10 pf elements dimensions: ≥ 10 μm overall dimensions: ≥ 2х2 mm
Metal photomasks (iron oxide, chromium) photomask elements: ≥ 3 μm
Microassemblies
microassemblies based on alumina ceramics, glass ceramics and ceramics sizes: from 2x5 mm to 60х48 mm and bigger frequency: up to 35 GHz
packaged microassemblies leakage: not more than 5x10-4 l.μm Hg./s
Semiconductor electronic units, crystal-based transistors ball-wedge / wedge-wedge bonding using ø40 mm gold wire dimensions: 1x1 mm
