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LF, HF and microwave hybrids


  • microstrip boards (resistive, switching)
  • discrete passive components
  • induction coils
  • circuit boards on FLAN dielectric with tin-bismuth alloy
  • copper foil plates coated with gold or tin-bismuth alloy
  • polycore padding
  • packaged and unpackaged hybrids of LF, HF, and microwave ranges
  • electronic semiconductor assembly units, crystal-based transistors with gold leads
  • metal-coated photomasks (iron oxide, chromium, emulsion)


  • substrates materials: polycore, glass ceramics, ferrite, barium titanate, ceramics
    • PCBs dimensions — from 1.5x1.5 mm to 60x48 mm, including round boards, 0.25—2 mm thick
    • holes and grooves of various shapes, transitional metallized holes; three-, four-, and five-sided metallization
    • thin-film resistors based on chromium, silicon alloys; specific resistivity of resistive layer —  from 1 to 10,000 Ohm/sq
    • conductors up to 24 µm thick with a minimum film width of 20 µm, manufacturing accuracy — ±5 µm
    • gold coating up to 6 µm, tin-bismuth alloy coating up to 12 µm
  • copper foil thickness — from 0.01—0.02 mm
  • polycore induction coils, with resistance from 4 Ohms to 500 Ohms with an accuracy of 2%, the total capacity — 5 and 10 pF, elements size — from 10 µm
  • polycore, glass ceramics, ceramics hybrids
    • dimensions — from 2x5 mm to 60x48 mm and more
    • frequency — up to 35 GHz
    • packaged microassemblies inleakage — up to  5*10-4 l·µm Hg/s
  • photomask elements — 2 µm and more


  • vacuum deposition of resistive and conductive layers with subsequent photolithography, electroplating of the front and back sides, application of protective and marking layers to the circuit by centrifugation
  • precision laser machining of polycore and RT/Duroid dielectric manufactured by Rogers company
  • all types of microwelding with 15 µm gold wires to 30x30 µm contact pads
  • eutectic brazing of crystals
  • sealing by casting or laser welding
  • bonding with 25, 50 µm gold and aluminum wires using ball bond / wedge bond method, onto 50x50 µm contact pads

Quality Control

  • parametric
  • functional
  • diagnostic


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