Manufacturing of LF, HF, and microwave hybrids

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Manufacturing of LF, HF, and microwave hybrids

Substrates are made of polycore, glass ceramics, ferrite, barium titanate, V-20, V-40, V-80, TL-0, TL-75, TL-100 ceramics
- board dimensions are from 1.5x1.5 mm to 60x48 mm, thickness of 0.25—2 mm
- holes and grooves of various shapes, transitional metallized holes; three-, four-, and five-sided metallization
- thin-film resistors based on chromium, RS-3710, RS-5000, RS-5402, RS-5406K, K-50S alloys, specific resistivity of resistive layer from 1 to 10,000 Ohm/sq
- conductors up to 24 microns thick with a minimum film width of 20 microns, manufacturing accuracy ±5 microns
- gold coating up to 6 microns and tin-bismuth alloy coating up to 12 microns
The thickness of the copper foil is from 0.01—0.02 mm
Polycore induction coils, with resistance from 4 Ohms to 500 Ohms with an accuracy of 2%, the total capacity of 5 and 10 pF, the size of elements is 10 microns and more
Polycore, glass ceramics, ceramics hybrids
- dimensions are 2x5 mm to 60x48 mm and more
- frequency is up to 35 GHz
- packaged microassemblies, leakage is up to 5*10^-4 l·µm Hg/s
Photomask elements are 2 microns and more.

Vacuum deposition of resistive and conductive layers with subsequent photolithography, electroplating of the front and back sides, application of protective and marking layers to the circuit by centrifugation
Precision laser machining of polycore and RT/Duroid dielectric manufactured by Rogers company
All types of micro welding with gold wire with a diameter of 15 microns to contact pads with a size of 30x30 microns
Eutectic brazing of crystals
Sealing by casting or laser welding
Splicing of gold and aluminum wire with a diameter of 25 microns, 50 microns for ball-wedge / wedge-wedge on contact pads with a size of 50x50 microns