PCBs dimensions — from 1.5x1.5 mm to 60x48 mm, including round boards, 0.25—2 mm thick
holes and grooves of various shapes, transitional metallized holes; three-, four-, and five-sided metallization
thin-film resistors based on chromium, silicon alloys; specific resistivity of resistive layer — from 1 to 10,000 Ohm/sq
conductors up to 24 µm thick with a minimum film width of 20 µm, manufacturing accuracy — ±5 µm
gold coating up to 6 µm, tin-bismuth alloy coating up to 12 µm
copper foil thickness — from 0.01—0.02 mm
polycore induction coils, with resistance from 4 Ohms to 500 Ohms with an accuracy of 2%, the total capacity — 5 and 10 pF, elements size — from 10 µm
polycore, glass ceramics, ceramics hybrids
dimensions — from 2x5 mm to 60x48 mm and more
frequency — up to 35 GHz
packaged microassemblies inleakage — up to 5*10-4 l·µm Hg/s
photomask elements — 2 µm and more
Technology
vacuum deposition of resistive and conductive layers with subsequent photolithography, electroplating of the front and back sides, application of protective and marking layers to the circuit by centrifugation
precision laser machining of polycore and RT/Duroid dielectric manufactured by Rogers company
all types of microwelding with 15 µm gold wires to 30x30 µm contact pads
eutectic brazing of crystals
sealing by casting or laser welding
bonding with 25, 50 µm gold and aluminum wires using ball bond / wedge bond method, onto 50x50 µm contact pads
