Electronic assemblies production using SMT mounting

Products

Electronic assemblies with SMT components

Specifications

  • Max. PCB size: 420х380 mm
  • Chip sizes: 01005...2225
  • Simultaneous assembly: 320 part types
  • Max component sizes: 45х100, height up tо 35 mm
  • Distance between BGA terminals: 0.5
  • Assembly of lead and lead-free components
  • Output: 50,000 components per hour
  • Automated components pick-and-place

Technologies

  • Convection solder reflow
  • Selective soldering
  • Ultrasonic rinsing
  • High-resolution X-ray control with with tomography function
  • Inspection
    • Parameters
    • Functionality
    • Diagnostic

Producer