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Electronic assemblies production using SMT mounting

Products

Electronic assemblies with surface-mounted components.

Specifications

  • max. PCB size: 420х380 mm
  • chips size: 01005…2225
  • simultaneous assembly: 320 part types
  • max. components size: 45х100, height up tо 35 mm
  • distance between BGA leads: 0.5
  • mounting of PB and PB-free components
  • output: 50,000 components per hour
  • automated components pick-and-place

Technologies

  • convection reflow soldering
  • selective soldering
  • ultrasonic rinsing
  • high-resolution X-ray control with with tomography function
  • inspection
    • parameters
    • functionality
    • diagnostic

Manufacturer